Product Introduction
Fine Copper(Cu)
Overview
1. High Copper Purity: Copper content reaches up to 99.95%.
2. Exceptional Thermal and Electrical Conductivity.
1. High Copper Purity: Copper content reaches up to 99.95%.
2. Exceptional Thermal and Electrical Conductivity.
Material parameter
Particle size distribution: 15–53 μm, 15–38 μm, 5–25 μm.
Flowability: ≤18s/50g.
Apparent density: ≥4.7 g/cm³ .
Flowability: ≤18s/50g.
Apparent density: ≥4.7 g/cm³ .
Oxygen content: ≤300 ppm.
Mechanical property
Tensile Strength: ≥ 240 MPa.
Yield Strength: ≥ 165 MPa.
Yield Strength: ≥ 165 MPa.
Application case
 |  |  |
| Heat Dissipation - IGBT | Heat Dissipation - Induction Coil | Heat Dissipation - Induction Coil |
Copper Alloy (CuCrZr)
Overview
1. Capable of withstanding high-temperature operating environments.
2. Superior mechanical properties under high-temperature conditions.
3. Material strength exceeds that of pure copper while exhibiting lower electrical conductivity compared to pure copper.
4. Suitable for large-layer-thickness additive manufacturing processes.
1. Capable of withstanding high-temperature operating environments.
2. Superior mechanical properties under high-temperature conditions.
3. Material strength exceeds that of pure copper while exhibiting lower electrical conductivity compared to pure copper.
4. Suitable for large-layer-thickness additive manufacturing processes.
Material parameter
Particle size distribution: 15–53 μm.
Flowability: ≤18s/50g.
Apparent density: ≥4.3 g/cm³ .
Oxygen content: ≤200 ppm.
Flowability: ≤18s/50g.
Apparent density: ≥4.3 g/cm³ .
Oxygen content: ≤200 ppm.
Nitrogen content: ≤200 ppm.
Mechanical property
| Tensile strength/MPa | Yield strength/MPa | Elongation/% | |
| Print State (Ambient Temperature) | ≥235 | ≥190 | ≥32 |
| Heat-treated state (ambient temperature) | ≥400 | ≥330 | ≥20 |
| Heat-treated state (at 500°C) | ≥200 | ≥200 | ≥10 |
Application case
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| Copper Alloy Liner for Liquid Propellant Rocket Engine Thrust Chamber | Copper Tailpipe |